Thursday, February 21, 2019

HUBER+SUHNER to present intelligent connectivity solutions to master 5G challenges at Mobile World Congress 2019

Solutions on display underline the company’s expertise in lean and efficient solutions for 5G network densificationHerisau, February 21, 2019 – HUBER+SUHNER, leading manufacturer of components and systems for electrical and optical connectivity, will unveil its solutions for mobile network densification at booth #6G20 at this year’s Mobile World Congress in Barcelona. The company’s presence at the show will focus on the forthcoming topology changes necessary to prepare for the continuously growing capacity requirements and complexity... Source: RealWire

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